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旧金山 - 经过长时间的延迟,英特尔将在6月开始发售其首批10纳米处理器,这与公司自去年以来一直在进行通信的时间表一致,高管们表示。

Intel also plans to begin shipping 7-nm processors in 2021, executives told analysts at the company's annual investor day. The 7-nm process technology will mark Intel's first use of extreme ultraviolet (EUV) lithography. 7纳米工艺技术将标志着英特尔首次使用极紫外(EUV)光刻技术。英特尔还计划在2021年开始发售7纳米处理器,这是该公司年度投资者日的高管。

Murthy Renduchintala, Intel's chief engineering officer and president of the company's Technology, Systems Architecture and Client Group, reiterated that Intel's first 10-nm processors to ship will be its Ice Lake notebook PC processors. Renduchintala added that Intel plans to launch several 10-nm products in 2019 and 2020.英特尔首席工程官兼公司技术,系统架构和客户组总裁Murthy Renduchintala重申英特尔首批推出的10纳米处理器将是其Ice Lake笔记本电脑处理器.Renduchintala补充称英特尔计划推出几款10纳米处理器2019年和2020年的产品。

The timing of 10-nm shipments has been an issue that Intel has grappled with for more than a year. Difficulties with ramping up the yield of 10 nm to acceptable production levels have caused a lengthy delay in the rollout of the chips, which were initially targeted for release in 2016. Intel's delays at 10 nm have contributed to the company losing some market share to longtime PC processor rival AMD, which plans to begin shipping 7-nm chips later this year. 10%nm出货量是英特尔一年多来一直在努力解决的问题。加速10纳米达到可接受的生产水平的困难导致了芯片推出的长时间延迟定于2016年发布。英特尔在10纳米的延迟已被纳入该公司,失去一些市场份额给长期的PC处理器竞争对手AMD,后者计划在今年晚些时候开始发售7纳米芯片。

Renduchintala told investors that the company's 7-nm process technology is expected to provide about 20% increase in performance per watt with a 4× reduction in design rule complexity. Renduchintala收费投资者表示,该公司的7纳米工艺技术预计将使每瓦性能提高约20%,同时设计规则复杂度降低4倍。

Intel's first 7-nm product is expected to be a general-purpose GPU for data center AI and high-performance computing based on Intel's Xe architecture. It will follow the launch of Intel's first discrete GPU, which is expected next year.英特尔首款7纳米产品预计将成为基于英特尔Xe架构的数据中心人工智能和高性能计算的通用GPU。它将推出英特尔首款独立GPU,预计将于明年推出。

Renduchintala said that Intel would increasingly shift from emphasizing transistor scaling and monolithic integration to emphasizing heterogeneous scaling and integration moving forward. (Source: Intel)Renduchintala表示,英特尔将逐步从强调晶体管扩展和集成集成转向强调异构扩展和集成向前发展。(来源:英特尔)

The 7-nm GPU will be available in Intel's advanced Foveros and EMIB packages, Renduchintala said. “Intel is developing the world's leading portfolio of advanced packaging technologies.” Renduchintala表示,7-nm GPU将采用英特尔先进的Foveros和EMIB封装,“英特尔正在开发世界领先的先进封装技术产品组合。”

Last December, Intel introduced Foveros, a new 3D packaging technology for face-to-face stacking of logic. The technology, which is expected to be available next year, is an early example of a broader push by the semiconductor industry toward heterogeneous integration — separately manufactured silicon and non-silicon components integrated into a three-dimensional system-in-a-package.去年12月,英特尔推出了Foveros,这是一种用于逻辑面对面堆叠的新型3D封装技术。该技术预计将于明年上市,是半导体行业向继承推广海报的早期例证。单独制造的硅和非硅元件集成到三维系统级封装中。

As with prior nodes, Intel plans to release intra-node optimizations at 7 nm. The company is targeting a 7-nm+ process in 2022 and a 7-nm++ process in 2023.该公司的目标是2022年的7纳米工艺和2023年的7纳米工艺。与之前的节点一样,英特尔计划发布7纳米的节点内优化。

Renduchintala said that Intel is undergoing a transition from its historical “tick-tock” cadence of chip scaling toward a new model of innovation that goes beyond brute-force scaling. This will involve the incorporation of new process technologies and new packaging technologies to integrate individual IC blocks — or chiplets — into a heterogeneous device. “Intel is expanding the formula of integration well beyond the single die,” he said.这将包含在该技术的进步中,因为它已经从其历史性的“滴答声”芯片缩放节奏转变为超越蛮力扩展的新创新模式。 IC块 - 或芯片 - 进入异构设备。“英特尔正在扩展集成公式,远远超出单一芯片”他说。

Renduchintala also said that Intel's future performance gains will be driven by innovations in six areas: process and packaging, architecture, memory, interconnect, security, and software. Renduchintala还表示,英特尔未来的性能提升将受到六个领域的创新驱动:流程和封装,架构,内存,互连,安全和软件。

Intel says that it's targeting a much larger total addressable market in the “data-centric” era. (Source: Intel)英特尔表示,它正在以“以数据为中心”的时代瞄准更大的可寻址市场。(来源:英特尔)

Also at the investor day, Intel CEO Bob Swan sketched out the company's plans and goals over the next several years. Intel will continue its ongoing transition from a “PC-centric” company to a “data-centric” company, supplying more chips for a broader array of end products.英特尔将继续从“以PC为中心”的公司向“以数据为中心”的公司转型,为英特尔提供更多芯片。更广泛的终端产品。

Swan said that Intel foresees growing annual sales from $70.8 billion last year to about $85 billion in 2022 or 2023. He said that the broadening of the company's product portfolio will enable Intel to grow its total addressable market from a little over $52 billion in PC and server chips last year to nearly $300 billion by 2023 across the data center, IoT, network, and PC sectors.他表示,英特尔预计年销售额将从去年的708亿美元增长到2022年或2023年的约850亿美元。他表示,该公司的产品组合将能够从略高于520亿美元的PC中解决总体可寻址市场问题。服务器芯片去年在数据中心,物联网,网络和个人电脑领域到2023年达到近3000亿美元。

Intel CEO Bob Swan speaks at the company's investor day Wednesday. (Source: Intel)英特尔首席执行官鲍勃·斯旺在周三的公司投资日发表讲话。(来源:英特尔)

“We are very focused on leading technology inflections that will accelerate and create demand for data — AI, 5G, and autonomous

,” Swan said. “We believe in an expanded market opportunity, we can play a bigger role in the success of our customers.” “我非常关注能够加速和创造数据需求的领先技术变革 - 人工智能,5G和自主[驾驶],”斯旺说。“我们相信扩大的市场机会,我们可以在成功中发挥更大的作用。我们的客户。“

Navin Shenoy, executive vice president and general manager of Intel's Data Center Group, announced that the company would increase the pace of releases for new Xeon CPUs to every four to five quarters from every five to seven quarters previously. XIV CPU以前每四到五个季度发布一次。英特尔数据中心集团执行副总裁兼总经理Navi shenoy宣布,该公司将把新Xeon CPU的发布速度提高到每四个季度一次。

· 2019-05-10 09:02  本新闻来源自:EE Times,版权归原创方所有

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