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安森美半导体和Globalfoundries通过出售纽约工厂实现双赢

安森美半导体公司已同意从Globalfoundries购买位于纽约东菲什基尔的300毫米晶圆厂,该晶圆厂将创建一项互惠协议,为两家公司的发展做好准备。

根据协议条款,安森美半导体将支付总额4.3亿美元,签署时上缴1亿美元。 剩余的3.3亿美元将在2022年底支付​​,届时安森美半导体将获得对该晶圆厂的全面运营控制,该网站的员工将加入安森美半导体。 这笔交易意味着安森美半导体公司在东菲什基尔工厂生产的300毫米产品数年增加,并为Globalfoundries提供了将其各种技术转移到该公司另外三个规模300毫米工厂的途径。 该协议的附加条款要求Globalfoundries为安森美半导体生产300毫米晶圆,直到2022年底。安森美半导体首次生产300毫米晶圆预计将于2020年开始。该协议还包括技术转让和开发协议以及技术许可协议,由经验丰富的300毫米制造和开发团队实现,该团队将安森美半导体晶圆工艺从200毫米转换为300毫米。 安森美半导体还将立即获得先进的CMOS功能,包括45纳米和65纳米技术节点,这些工艺将成为安森美半导体未来技术发展的基础。

原文:

ON Semiconductor Corporation has agreed to purchase a 300 mm fab in East Fishkill, New York, from Globalfoundries, which creates a mutually beneficial deal that will position both companies for growth.

Under terms of the agreement, ON Semiconductor will pay a total of USD 430 million, with USD 100 million turned over at signing. The balance of USD 330 million will be paid at the end of 2022, at which time ON Semiconductor will gain full operational control of the fab and the site's employees will join ON Semiconductor. The deal will mean an increase of ON Semiconductor's 300 mm production at the East Fishkill fab over several years, as well as give Globalfoundries a path to transitioning its various technologies to the company's three other at-scale 300 mm sites. Additional terms of the agreement call for Globalfoundries to manufacture 300 mm wafers for ON Semiconductor until the end of 2022. First production of 300 mm wafers for ON Semiconductor is expected to start in 2020. The agreement also includes a technology transfer and development agreement and a technology license agreement, enabled by an experienced 300 mm manufacturing and development team that will convert ON Semiconductor wafer processes from 200 mm to 300 mm. ON Semiconductor will also have immediate access to advanced CMOS capability including 45 nm and 65 nm technology nodes, processes that will form the basis for future technology development at ON Semiconductor.

· 2019-04-29 14:36  本新闻来源自:搜索 寄存器,版权归原创方所有

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