总部位于台湾的Group Up Industrial（GP）致力于提供自动化和半导体干法工艺设备，由于ABF基板，COF基板，类似基板的PCB制造商的大量产能扩张，2019年第三季度的订单明显可见。据公司消息来源称，SLP）和5G用PCBs。
GP总裁JK Li指出，他的公司正在跟随相关领域的领先制造商的脚步，开发高端产品的工艺设备。 例如，在SLP领域，台湾真鼎科技（ZDT），奥地利AT＆S，日本Meiko和中国深南赛道等领先制造商现在都是该公司的客户。
ABF和COF基板的制造商正在积极扩大产能以缓解供应短缺，为GP的2019年收入带来显着增长动力。 除了台湾现有两家主要的COF基板制造商扩大产能外，该公司的主要客户ZDT也正准备从不断增长的基板需求中获得更多收益。 Lee表示，一些ABF基板制造商也正在进行新一轮的产能扩张，因为他们的现有产能已经被下游客户完全预订。
GP还积极开展5G组件的过程设备部署。 该公司已开始利用中国深南电路和乌斯印刷电路的5G用刚性PCB供应链，以及许多用于5G天线和RF传输解决方案的柔性板制造商的供应链，包括台湾的ZDT，Flexium Interconnect和职业技术，以及中国的DSBJ。
Taiwan-based Group Up Industrial (GP), dedicated to supplying automation and semiconductor dry process equipment, has seen clear order visibility through the third quarter of 2019 thanks to significant capacity expansions by makers of ABF substrates, COF substrates, substrate-like PCBs (SLP) and 5G-use PCBs, according to company sources.
GP president JK Li pointed out that his company is following the footsteps of leading makers in related fields to develop process equipment for high-end products. In the SLP segment, for instance, such leading makers as Taiwan's Zhen Ding Technology (ZDT), Austria's AT&S, Japan's Meiko and China's Shennan Circuit are now all among the company's clients.
Makers of ABF and COF substrates are actively moving to expand capacities to ease supply shortages, generating significant growth momentum for GP's 2019 revenues. Besides Taiwan's existing two major makers of COF substrates expanding capacities, the firm's major client ZDT is also gearing up to gain more from the growing demand for the substrates. Some makers of ABF substrates are also carrying out a new wave of capacity expansions as their existing capacities are already fully booked by downstream clients, according to Lee.
GP is also aggressively proceeding with deployments in process equipment for 5G components. The company has tapped into the supply chains of 5G-use rigid PCBs by China's Shennan Circuits and Wus Printed Circuit, as well as the supply chains of many makers of flexible boards for 5G antenna and RF transmission solutions, including Taiwan's ZDT, Flexium Interconnect and Career Technology, as well as China's DSBJ.
Moreover, GP is developing process equipment for more auto-use products including glass decoration boards and batteries, in addition to traditional automotive PCBs.
GP has also zeroed in on higher-end semiconductor process equipment, including those for FOPLP (fan-out panel level packaging) and SiP (system in package), for its next step of development. The company has started negotiations with world-class clients in the packaging segment over cooperative development of related equipment.