加利福尼亚州米尔皮塔斯 - 2019年4月24日 - 拥有业界最密集的AI推理加速器的芯片创新者Gyrfalcon Technology Inc.（GTI）正在为该公司的Lightspeeur®2801和2803 AI加速器提供技术支持，用于定制SoC为寻求最终芯片定制水平的公司设计新的IP许可模式。
加速器芯片的架构采用超小型和低功耗的AI内核，支持内存中的AI处理（APiM），以及采用专有矩阵处理引擎（MPE™）架构配置的内核。 AI核心加速了Caffe，PyTorch和TensorFlow等AI框架上的卷积神经网络（CNN）。 GTI的加速器芯片结合了超过28,000个核心，Lightspeeur®2803的功率为16.8 TOPS，而Lightspeeur®2801仅使用300mW，同时提供2.8 TOPS。 通过提供MPE架构以及公司的开发和软件优化工具以及技术支持，SoC设计人员可以在芯片面积中以最低成本集成AI推理加速，并且功耗仅为毫瓦。
“当市场公司谈论AI芯片已经饱和时，GTI正在与众不同。我们已经生产了三种不同的AI Accelerator芯片，现在掌握在设计最终产品的客户手中，因此我们的芯片已经过验证。打算继续推出和生产新的AI Accelerator芯片，我们的技术100％专有，并受到广泛而深入的专利组合的保护。我们将为寻求新优势的公司提供GTI技术的优势，加速全球的增长AI芯片市场和我们技术的货币化，“Gyrfalcon Technology Inc.首席执行官Kimble Dong说。
该公司于2017年推出其首款Lightspeeur®2801芯片作为Edge AI解决方案，并于2018年在数据中心增加了第二个芯片，即针对云AI优化的Lightspeeur®2703。两者均在PCIe上提供16个芯片的配置名为GAINBOARD™系统产品的卡，用于升级需要提供AI服务的数据中心。 客户正在众多商业产品中设计Gyrfalcon芯片，包括：智能家居及办公产品，消费电子产品，手机及电脑，婴儿及宠物显示器，机器人真空吸尘器，缺陷检测设备，边缘服务器及人工智能数据中心解决方案。
Gyrfalcon是极少数AI加速器芯片公司之一，能够为客户提供领先的高性能USB 3.0加密狗，可与Windows和Linux PC或Raspberry Pi等硬件开发套件一起使用，用于模型创建，芯片评估和概念验证设计。 被许可方可以访问开发硬件，例如USB加密狗，分立芯片或多芯片板，以及IP开发工具和技术文档，以及公司的AI芯片设计专业知识。 有关新许可模式的具体信息，请访问https://www.gyrfalcontech.ai/solutions/ip-licensing 。
关于Gyrfalcon Technology Inc.
Gyrfalcon Technology Inc.（GTI）是全球领先的高性能AI加速器开发商，采用低功耗封装，低成本和小尺寸芯片。 GTI由资深硅谷企业家和人工智能科学家创建，通过将云人工智能的强大功能引入本地设备，推动人工智能的应用，并以更高的性能和效率提高云AI性能，为新设备提供最大的AI定制服务。 AI升级到客户的途径。 有关GTI的更多信息，请访问https://www.gyrfalcontech.ai/ 。
Speeding Up SoC Design in the Cloud with Enhanced Productivity
Hsinchu, Taiwan, ROC – April 26, 2019 – TSMC (TWSE: 2330, NYSE: TSM) today announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence, Microsoft Azure, and Synopsys. This expansion with new cloud-ready design solutions broadens TSMC's OIP ecosystem and helps customers unleash innovations with TSMC process technologies.
Enabling New Cloud Solutions
Mentor is now certified for the TSMC Cloud Alliance, as Mentor's process and procedures for protecting IP in the cloud have met TSMC's standards. In addition, TSMC has validated that Mentor's Calibre ®physical verification EDA solution can accelerate completion of verification runs by harnessing the scalability of the cloud. Through a joint project with Mentor, Microsoft Azure, and TSMC, a 5nm test chip from TSMC took less than four hours to complete its verification thanks to the productivity boost enabled by Calibre in the cloud. This performance demonstrates how the power of cloud computing, combined with TSMC know-how and our partners' innovation, can provide mutual customers with additional options for optimizing tapeout schedules.
The Cloud Alliance also gains another solution with the Cadence ® CloudBurst TM Platform. The CloudBurst Platform supports TSMC's OIP VDE and enables customers to select critical parts of their EDA workload based on project needs to deploy to the cloud. It simplifies cloud adoption and boosts productivity with massive cloud computing power and fast, easy access to pre-installed Cadence design tools in a ready-to-use hybrid cloud environment running on Amazon Web Services (AWS) or Microsoft Azure. It is production-proven and has supported a successful customer tapeout on TSMC's 7nm technology.
Leveraging the TSMC and Synopsys VDE collaboration, several partners and customers have accelerated their move to the cloud and have successfully completed designs on the cloud. eSilicon has been using their Synopsys-based implementation flow to build complex IP on the cloud targeting TSMC's advanced technologies.
“More and more designers are adopting the cloud after TSMC pioneered the Cloud Alliance six months ago, and it is an exciting time to expand our partnerships further,” said Cliff Hou, vice president of Technology Development at TSMC. “We've seen customers of all sizes leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies. Customers have taped out their 7nm products using solutions from our Cloud Alliance, and we have used it in our 5nm development to speed up memory, standard cell, and EDA design infrastructure deliveries to our customers. With the foundry segment's most comprehensive cloud ecosystem, TSMC and its partners provide our customers with a competitive edge through optimized cloud-ready design solutions to bring their products to market sooner, with higher quality.”
Alliance Partner Quotes
“Customers have varying design requirements to consider as they migrate to the cloud, and Cadence recently expanded its industry-leading cloud portfolio with the new CloudBurst platform to address the complexities of hybrid cloud deployments. Through our long, close collaboration with TSMC, AWS, and Microsoft Azure, we're jointly enabling customers to meet compressed schedule deadlines, increase throughput, and improve overall productivity. We're continuing to see growing demand for cloud adoption, and the successful customer tapeouts to date are indicative of the transformative potential the cloud brings to the electronic design industry.”
-Dr. Anirudh Devgan, President, Cadence
“We at Mentor are happy to become a certified member of TSMC's Cloud Alliance. Our Calibre platform has become a benchmark for scalability and runtime performance in both traditional and cloud configurations. This certification as a TSMC Cloud Alliance member will give our mutual customers more freedom to use best-in-class tools in whichever compute configuration they choose to use.”
-Joe Sawicki, Executive Vice President, Mentor IC Segment
“The deep cooperation between Microsoft and TSMC, with a shared vision of the cloud, has driven our joint innovation on technology components, engineering solutions and business models. At Microsoft we've seen the activity level of semiconductor design in the cloud increases significantly since the launch of the Cloud Alliance partnership. The most recent collaboration with Mentor enabling high scalability for customers' IC design physical verification with massive cloud compute is yet another example of Azure's commitment to accelerate digital transformation and adoption of the public cloud for the entire semiconductor industry.”
-Rani Borkar, Corporate Vice President, Microsoft Azure
“As an inaugural partner in 2018, we whole-heartedly support the TSMC Cloud Alliance and the OIP Virtual Design Environment. We are seeing increased adoption of cloud for EDA workloads, and are collaborating with TSMC and customers like eSilicon to drive this momentum. Additionally, we recently announced IC Validator NXT built with a massively parallel architecture designed specifically for cloud scalability and to support environments like VDE. ”
-Deirdre Hanford, Co-GM, Design Group, Synopsys