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台积电通过新合作伙伴和新解决方案支持加强OIP云联盟

加速生产力提升云中的SoC设计

新竹,台湾,中华民国 - 2019年4月26日 -台积电( 台湾证券交易所代码:2330,纽约证券交易所代码:TSM)今天宣布扩大开放式创新平台® (OIP)云联盟,Mentor加入首届成员亚马逊网络服务,Cadence,Microsoft Azure和Synopsys。 这种通过新的云就绪设计解决方案的扩展拓宽了台积电的OIP生态系统,并帮助客户利用TSMC工艺技术释放创新。

启用新的云解决方案 
Mentor现已获得TSMC云联盟认证,因为Mentor在云中保护IP的流程和程序符合台积电的标准。 此外,台积电已经验证了Mentor的Caliber®物理验证EDA解决方案可以通过利用云的可扩展性来加速验证运行的完成。 通过与Mentor,Microsoft Azure和TSMC的联合项目,台积电的5nm测试芯片花了不到4个小时就完成了验证,这要归功于Calibre在云端提供的生产力提升。 此性能展示了云计算的强大功能,结合台积电的专有技术和我们合作伙伴的创新,可以为共同客户提供优化流片时间表的附加选项。

云联盟还通过Cadence®CloudBurstTM平台获得了另一个解决方案。 CloudBurst平台支持TSMC的OIP VDE,使客户能够根据项目需求选择其EDA工作负载的关键部分,以部署到云。 它通过大量云计算能力简化云采用并提高工作效率,并在亚马逊网络服务(AWS)或Microsoft Azure上运行的即用型混合云环境中快速,轻松地访问预装的Cadence设计工具。 它经过生产验证,并支持TSMC 7nm技术的成功客户流片。

利用TSMC和Synopsys VDE协作,多个合作伙伴和客户加快了迁移到云计算并成功完成了云计算。 eSilicon一直在使用基于Synopsys的实施流程,在云上构建复杂的IP,以TSMC的先进技术为目标。

“台积电六个月前率先推出云联盟后,越来越多的设计师采用云计算,这是进一步拓展合作伙伴关系的激动人心的时刻,”台积电技术开发副总裁Cliff Hou表示。 “我们已经看到各种规模的客户利用云来提高生产力,同时设计TSMC的尖端技术。 客户已使用我们的云联盟解决方案录制了7nm产品,我们已将其用于5nm开发,以加快向客户提供内存,标准单元和EDA设计基础架构的速度。 凭借代工部门最全面的云生态系统,台积电及其合作伙伴通过优化的云就绪设计解决方案为我们的客户提供竞争优势,从而以更高的质量将产品更快地推向市场。

联盟合作伙伴行情 
“客户在迁移到云时需要考虑不同的设计要求,Cadence最近使用新的CloudBurst平台扩展了业界领先的云产品组合,以解决混合云部署的复杂性问题。 通过与TSMC,AWS和Microsoft Azure的长期紧密合作,我们共同帮助客户满足压缩的计划期限,提高吞吐量并提高整体生产力。 我们继续看到对云采用的需求不断增长,迄今为止成功的客户流片表明了云为电子设计行业带来的变革潜力。“ 
-Dr。 Cadence总裁Anirudh Devgan

“我们Mentor很高兴成为台积电云联盟的认证成员。 我们的Calibre平台已成为传统和云配置中可扩展性和运行时性能的基准。 作为台积电云联盟成员的此认证将使我们的共同客户能够更自由地使用他们选择使用的任何计算配置中的最佳工具。“ 
-Joe Sawicki,Mentor IC部门执行副总裁

“微软与台积电之间的深度合作,以及云的共同愿景,推动了我们在技术组件,工程解决方案和商业模式方面的共同创新。 在微软,我们已经看到自云联盟合作推出以来,云中半导体设计的活动水平显着提高。 最近与Mentor合作,通过大规模云计算为客户的IC设计物理验证提供高可扩展性,这是Azure致力于加速整个半导体行业数字化转型和采用公共云的另一个例子。 
-Rani Borkar,Microsoft Azure公司副总裁

“作为2018年的首个合作伙伴,我们全心全意地支持TSMC云联盟和OIP虚拟设计环境。 我们看到EDA工作负载越来越多地采用云,并且正在与台积电和eSilicon等客户合作推动这一势头。 此外,我们最近宣布IC Validator NXT采用大规模并行架构,专为云可扩展性而设计,并支持VDE等环境。 ” 
-Deirdre Hanford,Synopsys设计集团联合总经理

原文:

TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement

Speeding Up SoC Design in the Cloud with Enhanced Productivity

Hsinchu, Taiwan, ROC – April 26, 2019 – TSMC (TWSE: 2330, NYSE: TSM) today announced the expansion of the Open Innovation Platform ® (OIP) Cloud Alliance, with Mentor joining inaugural members Amazon Web Services, Cadence, Microsoft Azure, and Synopsys. This expansion with new cloud-ready design solutions broadens TSMC's OIP ecosystem and helps customers unleash innovations with TSMC process technologies.

Enabling New Cloud Solutions 
Mentor is now certified for the TSMC Cloud Alliance, as Mentor's process and procedures for protecting IP in the cloud have met TSMC's standards. In addition, TSMC has validated that Mentor's Calibre ®physical verification EDA solution can accelerate completion of verification runs by harnessing the scalability of the cloud. Through a joint project with Mentor, Microsoft Azure, and TSMC, a 5nm test chip from TSMC took less than four hours to complete its verification thanks to the productivity boost enabled by Calibre in the cloud. This performance demonstrates how the power of cloud computing, combined with TSMC know-how and our partners' innovation, can provide mutual customers with additional options for optimizing tapeout schedules.

The Cloud Alliance also gains another solution with the Cadence ® CloudBurst TM Platform. The CloudBurst Platform supports TSMC's OIP VDE and enables customers to select critical parts of their EDA workload based on project needs to deploy to the cloud. It simplifies cloud adoption and boosts productivity with massive cloud computing power and fast, easy access to pre-installed Cadence design tools in a ready-to-use hybrid cloud environment running on Amazon Web Services (AWS) or Microsoft Azure. It is production-proven and has supported a successful customer tapeout on TSMC's 7nm technology.

Leveraging the TSMC and Synopsys VDE collaboration, several partners and customers have accelerated their move to the cloud and have successfully completed designs on the cloud. eSilicon has been using their Synopsys-based implementation flow to build complex IP on the cloud targeting TSMC's advanced technologies.

“More and more designers are adopting the cloud after TSMC pioneered the Cloud Alliance six months ago, and it is an exciting time to expand our partnerships further,” said Cliff Hou, vice president of Technology Development at TSMC. “We've seen customers of all sizes leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies. Customers have taped out their 7nm products using solutions from our Cloud Alliance, and we have used it in our 5nm development to speed up memory, standard cell, and EDA design infrastructure deliveries to our customers. With the foundry segment's most comprehensive cloud ecosystem, TSMC and its partners provide our customers with a competitive edge through optimized cloud-ready design solutions to bring their products to market sooner, with higher quality.”

Alliance Partner Quotes 
“Customers have varying design requirements to consider as they migrate to the cloud, and Cadence recently expanded its industry-leading cloud portfolio with the new CloudBurst platform to address the complexities of hybrid cloud deployments. Through our long, close collaboration with TSMC, AWS, and Microsoft Azure, we're jointly enabling customers to meet compressed schedule deadlines, increase throughput, and improve overall productivity. We're continuing to see growing demand for cloud adoption, and the successful customer tapeouts to date are indicative of the transformative potential the cloud brings to the electronic design industry.” 
-Dr. Anirudh Devgan, President, Cadence

“We at Mentor are happy to become a certified member of TSMC's Cloud Alliance. Our Calibre platform has become a benchmark for scalability and runtime performance in both traditional and cloud configurations. This certification as a TSMC Cloud Alliance member will give our mutual customers more freedom to use best-in-class tools in whichever compute configuration they choose to use.” 
-Joe Sawicki, Executive Vice President, Mentor IC Segment

“The deep cooperation between Microsoft and TSMC, with a shared vision of the cloud, has driven our joint innovation on technology components, engineering solutions and business models. At Microsoft we've seen the activity level of semiconductor design in the cloud increases significantly since the launch of the Cloud Alliance partnership. The most recent collaboration with Mentor enabling high scalability for customers' IC design physical verification with massive cloud compute is yet another example of Azure's commitment to accelerate digital transformation and adoption of the public cloud for the entire semiconductor industry.” 
-Rani Borkar, Corporate Vice President, Microsoft Azure

“As an inaugural partner in 2018, we whole-heartedly support the TSMC Cloud Alliance and the OIP Virtual Design Environment. We are seeing increased adoption of cloud for EDA workloads, and are collaborating with TSMC and customers like eSilicon to drive this momentum. Additionally, we recently announced IC Validator NXT built with a massively parallel architecture designed specifically for cloud scalability and to support environments like VDE. ” 
-Deirdre Hanford, Co-GM, Design Group, Synopsys

· 2019-04-27 21:23  本新闻来源自:长芯半导体,版权归原创方所有

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